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Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Evaluation of the Schottky Contact Degradation on the Temperature Transient Measurements in GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Optimized thermal sensor allocation for field-programmable gate array temperature measurements based on self-heating test
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Monitoring of early catastrophic optical damage in laser diodes based on facet reflectivity measurement
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Study of Heat Transport Behavior in GaN-Based Transistors by Schottky Characteristics Method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Effect of poling process on resistive switching in Au/BiFeO3/SrRuO3 structures
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Identifying the spatial position and properties of traps in GaN HEMTs using current transient spectroscopy
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Degradation of the die attach layer in chip-on-board packaged light-emitting diodes during temperature cycling
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal time-constant spectrum extraction method in AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
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