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Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

A Novel Method for Measuring the Temperature in the Active Region of Semiconductor Modules

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Failure Mechanism of Phosphor Layer for High-Power GaN-Based White-LED

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal resistance analysis related to the degradation of GaAs-Based laser diodes

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Error Correction of Theory Model in Process-Stress Accelerated Test

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Evaluation of VDMOS Storage Failure Rate Based on Accelerated Factor

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal stability evaluation of die attach for high brightness LEDs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Channel Temperature Measurement of AlGaN/GaN HEMTs by Forward Schottky Characteristics

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

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