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Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

2012
期刊 IEEE Photonics Technology Letters
  • 卷 24
  • 期 5
  • 页码 398-400
  • Institute of Electrical and Electronics Engineers (IEEE)
  • ISSN: 1041-1135
  • DOI: 10.1109/lpt.2011.2179925