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Effect of Surface Micromorphology and Roughness of Iron Ingot on Microstructures of Hot-Dip Galvanized Coating

腐蚀与防护实验室 , 常州大学

Microstructure and mechanical properties of Al–Si alloy modified with Al–3P

腐蚀与防护实验室 , 常州大学

Synergy of ball-milling and pre-oxidation on microstructure and corrosion resistance of hot-dip zinc coating of nodular cast iron

腐蚀与防护实验室 , 常州大学

The 600 °C Isothermal Section of the Al-Cu-Ti Ternary System

腐蚀与防护实验室 , 常州大学

Trap Characterization of Trench-Gate SiC MOSFETs based on Transient Drain Current

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Research on Transient Temperature Rise Measurement Method for Semiconductor Devices Based on Photothermal Reflection

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Analysis of the Degradation of Depletion-Mode GaN High-Electron-Mobility Transistors under Reverse Pulse Electrical Stress Using the Voltage-Transient Method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Interactions between Elemental Selenium and Hydrophilic/Hydrophobic Surfaces: Direct Force Measurements Using AFM

表界面科学实验室 , 西南石油大学

A thermal boundary resistance measurement method based on a designed chip with the heat source separated from the temperature sensor

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

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