简历详情

Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation

期刊: IEEE Transactions on Electron Devices  2023
作者: Shiwei Feng,Shijie Pan,Yaosheng Li,Zhongyuan Chen,Jinyuan Li,Juewen Ding,Yunong Liu,Wenyi Tsai,Shaoxiong Cui,Chunsheng Guo
DOI:10.1109/ted.2023.3250183

Non-destructive peak junction temperature measurement of double-chip IGBT modules with temperature inhomogeneity

Abstract Considering the problem of measuring the peak junction temperature of a double-chip module with temperature inhomogeneity, we use a double-chip parallel model to analyze peak junction temperature measurement error for the traditional electrical method. An improved test method is proposed that is based on the small current–voltage drop method—specifically the dual current test method employing an extended-dimension calibration curve library. This method realizes a match of the calibration current with the test current by expanding the dimension database, eliminates errors of temperature measurements, and finally obtains the peak junction temperature of the module. The measurement result is close to the set temperature of the model, thereby verifying its accuracy.

期刊: Journal of Physics: Conference Series  2021
作者: Shiwei Zhang,Yunong Liu,Hao Guo,Chunsheng Guo,Lei Wei
DOI:10.1088/1742-6596/1907/1/012046

Multi-physics field coupling simulation modeling and analysis of StakPak insulated gate bipolar transistor device

期刊: 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME)  2021
作者: Lei Wei,Hao Guo,Chunsheng Guo,Yunong Liu
DOI:10.1109/icedme52809.2021.00065