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Measuring Junction Temperature Inhomogeneity of Double-chip IGBT Modules by Electrical Method

期刊: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)  2020
作者: Shiwei Zhang,Lei Wei,Boyang Liu,Chunsheng Guo,Sijin Wang
DOI:10.1109/icedme50972.2020.00032