简历详情
论文
Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current
期刊: IEEE Transactions on Power Electronics 2019作者: Chunsheng Guo,Hui Zhu,Lei Shi,Yuxuan Xiao,Kun Bai,Yamin Zhang,Shiwei Feng,Bangbing Shi
DOI:10.1109/tpel.2019.2894346
Temperature distribution measurement based on field-programmable gate array embedded ring oscillators
期刊: Solid-State Electronics 2019作者: Bangbing Shi,Yamin Zhang,Shiwei Feng,Wenjuan Yu
DOI:10.1016/j.sse.2019.05.002
Junction Temperature measurement of SiC BJT via the voltage drop of V<inf>BC</inf>
期刊: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) 2018作者: Kun Bai,Ya-Min Zhang,Quan-Bo He,Shi-Wei Feng,Bang-Bing Shi
DOI:10.1109/icsict.2018.8564990
Temperature distribution measurement for chips based on FPGA
期刊: 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) 2018作者: Bang-Bing Shi,Ya-Min Zhang,Shi-Jie Pan,Shi-Wei Feng,Wen-Juan Yu
DOI:10.1109/icsict.2018.8564914
Junction Temperature Measurement Method for Power mosfets Using Turn-On Delay of Impulse Signal
期刊: IEEE Transactions on Power Electronics 2018作者: Hui Zhu,Yamin Zhang,Dong Shi,Lei Shi,Shiwei Feng,Bangbing Shi
DOI:10.1109/tpel.2017.2736523
Variation of Dominant Degradation Mechanism in AlGaN Barrier Layer With Different Voltage Stress on the Gate of AlGaN/GaN High Electron Mobility Transistors
期刊: IEEE Electron Device Letters 2015作者: Kun Liu,Bangbing Shi,Yamin Zhang,Shiwei Feng,Lei Shi
DOI:10.1109/led.2015.2399774
