简历详情
论文
Effect of interface morphology on thermal contact resistance in thermal management of electronic devices
期刊: International Journal of Modern Physics B 2022作者: Xuan Li,Kun Bai,Xin He,Ya-Min Zhang,Shi-Wei Feng,Yu-Zheng Chen
DOI:10.1142/s0217979222500928
Characterization of thermal-resistance in Ga2O3 Schottky barrier diodes with temperature-sensitive electrical parameters
期刊: Semiconductor Science and Technology 2021作者: Shijie Pan,Kun Bai,Xin He,Yuangang Wang,Yuanjie Lv,Zhihong Feng,Shiwei Feng,Xuan Li
DOI:10.1088/1361-6641/ac1d23
Identifying the Properties of Traps in GaN High-Electron-Mobility Transistors via Amplitude Analysis Based on the Voltage-Transient Method
期刊: IEEE Transactions on Electron Devices 2021作者: Lixing Zhou,Yamin Zhang,Kun Bai,Xin He,Xiaozhuang Lu,Xiang Zheng,Xuan Li,Shiwei Feng,Shijie Pan
DOI:10.1109/ted.2021.3108755
A new method for detecting heteromorphic workpiece brazing layer quality based on thermal probe
期刊: Review of Scientific Instruments 2021作者: Shijie Pan,Sheng Wang,Kun Bai,Xin He,Yamin Zhang,Shiwei Feng,Chaoxu Hu
DOI:10.1063/5.0054559
Effect of high- and low-side blocking on short-circuit characteristics of SiC MOSFET
期刊: Microelectronics Reliability 2021作者: Xuan Li,Shijie Pan,Xin He,Xiang Zheng,Shiwei Feng,Kun Bai
DOI:10.1016/j.microrel.2021.114227
Effects of temperature and bias voltage on electron transport properties in GaN highelectron-mobility transistors
期刊: IEEE Transactions on Device and Materials Reliability 2021作者: Kun Bai,Xuan Li,Xin He,Xiang Zheng,Shiwei Feng,Shijie Pan
DOI:10.1109/tdmr.2021.3109088
Non-destructive testing of heteromorphic workpiece brazing layer quality based on heat conduction
期刊: 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME) 2021作者: Sheng Wang,Kun Bai,Xin He,Shiwei Feng,Chaoxu Hu
DOI:10.1109/icedme52809.2021.00014
Effects of gamma irradiation on GaN high-electron-mobility transistors characterized by the voltage-transient method
期刊: Semiconductor Science and Technology 2021作者: Yamin Zhang,Lixing Zhou,Kun Bai,Xin He,Chaoxu Hu,Xiaozhuang Lu,Xiang Zheng,Xuan Li,Shiwei Feng,Shijie Pan
DOI:10.1088/1361-6641/ac1563
Effect of Surface Roughness on Thermal Contact Resistance of Fixed Interface in Thermal Measurement of Electron Device
期刊: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME) 2020作者: Xuan Li,Kun Bai,Xin He,Yamin Zhang,Shiwei Feng,Yuzheng Chen
DOI:10.1109/icedme50972.2020.00017
A Drain–Source Connection Technique: Thermal Resistance Measurement Method for GaN HEMTs Using TSEP at High Voltage
期刊: IEEE Transactions on Electron Devices 2020作者: Lin Bai,Gang Lin,Shijie Pan,Xin He,Xiang Zheng,Yuxuan Xiao,Kun Bai,Yamin Zhang,Chang Liu,Shiwei Feng,Xuan Li
DOI:10.1109/ted.2020.3033259
A New Method for Measuring Thermal Characteristics of Multistage Depressed Collectors
期刊: IEEE Transactions on Electron Devices 2019作者: Manpo Yang,Wenjuan Yu,Shiwei Feng,Yamin Zhang,Xin He
DOI:10.1109/ted.2019.2947423
A New Differential Amplitude Spectrum for Analyzing the Trapping Effect in GaN HEMTs Based on the Drain Current Transient
期刊: IEEE Transactions on Electron Devices 2017作者: Yu Wang,Xin He,Yamin Zhang,Shiwei Feng,Xiang Zheng
DOI:10.1109/ted.2017.2654481
Optimized thermal sensor allocation for field-programmable gate array temperature measurements based on self-heating test
期刊: Microelectronics Journal 2017作者: Xin He,Chao Wang,Yamin Zhang,Shiwei Feng,Jingwei Li
DOI:10.1016/j.mejo.2016.11.013
Rapid test method for thermal characteristics of semiconductor devices
期刊: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) 2017作者: Yamin Zhang,Xin He,Jingwei Li,Xiang Zheng,Dong Shi,Shiwei Feng
DOI:10.1109/semi-therm.2017.7896932
Analysis of the hybrid trapping effect in GaN HEMTS based on the current transient spectroscopy
期刊: 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) 2016作者: Yu Wang,Xin He,Yamin Zhang,Shiwei Feng,Xiang Zheng
DOI:10.1109/icsict.2016.7998916