Novel Semiconductor Devices and Reliability Lab
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Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method
2011
期刊
Chinese Physics B
- 卷 20
- 期 2
- 页码 027202
- IOP Publishing
- ISSN: 1674-1056
- DOI: 10.1088/1674-1056/20/2/027202
