Novel Semiconductor Devices and Reliability Lab
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Thermal investigation of LED array with multiple packages based on the superposition method
2015
期刊
Microelectronics Journal
- 卷 46
- 期 7
- 页码 632-636
- Elsevier BV
- ISSN: 0026-2692
- DOI: 10.1016/j.mejo.2015.03.010
