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Thermal Resistance Analysis of 600 A IGBT Half-bridge Module in Power Cycling Tests

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

In-situ Thermal resistance measurement of GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

TCAD modeling of 3D 4H-SiC MOSFET and simulation of heat distribution during power cycling

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Advanced thermal boundary resistance measurement techniques for thick-film diamond heterostructures

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Research on double-sided heat dissipation of PressPack IGBT based on thermal resistance composition

Novel Semiconductor Devices and Reliability Lab , 北京工业大学