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Real-time measurement and control of junction temperature of VDMOS in power cycle test

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal analysis of ICs based on equivalent thermal resistance

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Structure optimization of heat sink for high power LED street lamp

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Experimental study on the reliable working life of PUF chip for 8 years

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Thermal analysis of ICS based on equivalent thermal resistance and skill language

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Reliability of solder joints in High-power LED package in power cycling tests

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The investigation of failure mechanism of n-GaN/Ti/Al/Ni/Au ohmic contact by novel TLM

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Aluminophosphate-17 and silicoaluminophosphate-17 membranes for CO2 separations

气体分离膜实验室-周荣飞课题组 , 南京工业大学
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